The PSA matrix is filled with silver coated fillers which allow interconnection between substrates through the adhesive thickness (the Z axis) and also provides electrical conductivity in the plane of the adhesive (X-Y axis). The eCAP 9705 is ideal for electrical bonding and ESD grounding of electronic and electrical devices, and can be applied as die cut parts or in roll form and has good adhesion to common EMI/RFI substrates such as aluminum, stainless steel, and smooth gasket materials.
(3) 3M™ Electrically Conductive Tape 9703 is used for grounded EMI/RFI shielding attachment or interconnection of silver ink/ polyester based flexible circuits. Tape 9703 provides stable electrical performance at moderately high temperatures and good adhes
Provides stable electrical performance at moderately high temperatures and good adhesion to metallic and other commonly used surfaces, including polyimide and polyester flex circuit materials, FR-4 board, copper, steel, aluminum and more. It is a permanently tacky system consisting of a PSA matrix with aligned conductive particles. These particles allow electrical conduction through the adhesive thickness (Z-axis), but not in the plane of the tape. The PSA properties of tape 9703 make it easy to handle and apply without need for thermal bonding. Tape 9703 is also repositionable and reworkable.
(2) Best XYZ conductivity with Good adhesion, Best of 3M's isotropic offerings for inherent EMI Shielding Effectiveness. Excellent choice for EMI shield & gasket attachment and grounding applications, plus can provide excellent electrical interconnection of circuits. Good adhesion to common substrates such as copper, aluminum, gold, stainless steel, FR-4 epoxy, Kapton polyimide and polyester films. No thermal bonding. Easy to apply.
(4) Ideal for attaching EMI shields to electronic and electrical devices. Can be used with many types of foil laminate shields, such as aluminum/PVC or copper/PVC laminates, to provide a customized shielding solution. May also be used to attach conductive fabric/foam core EMI gaskets to electronic cabinetry
(4) 3M™ Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are used to mechanically and thermally bond electronic components (packages and flexible circuits) to heat sinks or heat sensors. These tapes allow for easy joining of many substrates with light pressure in just seconds at room temperature. 3M™ Thermally Conductive Adhesive Transfer Tapes are permanently tacky tapes consisting of a 2.0 mil, 5.0 mil, or 10.0 mil thick pressure sensitive adhesive (PSA) film filled with ceramic particles. These particles allow thermal conduction through the tape. The tape yields an excellent combination of thermal conductivity, electrical isolation and adhesion. The transfer tape format means there is no carrier layer, which ...